| 摘要 |
The smart card has a card carrier provided with a milled recess in one of its major surfaces. The recess is for reception of a semiconductor chip (25) with antenna contacts (31,32) for connection to the inductive antenna. The antenna is provided by an antenna coil layer (11) within the card carrier. The antenna coil layer has chip contacts (20,21) cooperating with the antenna contacts of the semiconductor chip. It has thickened sections (16,17) embedded in the card carrier and exposed during milling, to ensure good contact with the antenna contacts. |
