发明名称 Non-volatile memory device and method of manufacturing the same
摘要 A non-volatile memory device includes gate insulating films formed on a semiconductor substrate and spaced apart from each other. A tunnel insulating film is formed on the semiconductor substrate and interposed between the adjacent gate insulating films. A memory transistor gate is formed on the tunnel insulating film and the gate insulating film interposing the tunnel insulating film therebetween. A select transistor gate is formed on the gate insulating film spaced apart from the memory transistor gate. A first doped region is formed in a portion of the semiconductor substrate under the memory transistor gate and extending to overlap one end of the select transistor gate. A second doped region is formed in a portion of the semiconductor substrate spaced apart from the first doped region and overlapping one end of the memory transistor opposite to the select transistor gate. A third doped region is formed in a portion of the semiconductor substrate spaced apart from the first doped region and overlapping the other end of the select transistor gate. The second doped region has a low-density doped region and a high-density doped region and is shallower in depth than the first and third doped regions.
申请公布号 US6555869(B2) 申请公布日期 2003.04.29
申请号 US20020056478 申请日期 2002.01.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK WEON-HO
分类号 G11C16/04;H01L21/8247;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/788 主分类号 G11C16/04
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