| 摘要 |
A packaged device includes a package substrate and a plurality of optical structures formed on a semiconductive substrate and positioned on the package substrate, forming an active area. The packaged device further includes a contiguous solderable seal structure surrounding the plurality of optical structures and a cap formed over the plurality of optical structures and upon the contiguous solderable seal structure. The cap has, formed thereon, patterned metalization. The patterned metalization is located over the active area.
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