Method for laser scribing of wafers

摘要

A method for laser scribing a semiconductor substrate with coatings on top. The method comprises the steps of focusing a laser beam on a top surface of the substrate coating; absorbing energy from the laser into the coating layer; forming a first set of scribe lines in a first direction on the substrate by scanning the laser beam across the surface of the substrate to evaporate portions of the coating layer; and forming a second set of scribe lines in a second direction on the surface of the substrate substantially orthogonal to the first set of scribe lines to evaporate portions of the layer.