发明名称 |
Semiconductor manufacturing apparatus, method for cleaning the semiconductor manufacturing apparatus, and light source unit |
摘要 |
There is described a semiconductor manufacturing apparatus for coating the surface of a semiconductor wafer with an organic coating, such as anti-reflective coating, which shortens a down time required in association with removal of compounds that tend to sublime and enables simplification of removal of the compounds and an increase in safety of the removal operation. A top plate of a hot plate unit for heating a semiconductor wafer is formed from light-transmissive material such as quartz. A light source unit for illuminating UV-rays effective for decomposing organic compounds is disposed on the top plate. The hot plate unit bakes the semiconductor wafer coated with the organic material, and compounds that have a tendency to sublime including organic material adhere to the lower surface of the top plate in association with the baking operation. Every time a predetermined number of semiconductor wafers have been processed by the hot plate unit, the light source unit radiates UV-rays onto the compounds adhering to the top plate.
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申请公布号 |
US6555790(B1) |
申请公布日期 |
2003.04.29 |
申请号 |
US20000547925 |
申请日期 |
2000.04.11 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA;RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION |
发明人 |
ONO YOSHIHARU;HATTORI SACHIKO;ODAMURA YUKO |
分类号 |
H01L21/027;F27B5/14;F27B17/00;F27D99/00;G03F7/11;G03F7/16;H01L21/00;H01L21/304;(IPC1-7):F27B5/14 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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