| 摘要 |
PURPOSE: A chip size package is provided to prevent bending of a ceramic board after a molding process and exfoliation between the circuit board and the molding part during a packaging process by forming a groove between each unit arranged in a matrix type. CONSTITUTION: A strip of a ceramic board(s) is prepared. Ceramic board units(u) are arranged in a matrix type. In each unit, a chip bonding pad(15) and a wire bonding pad(16) are formed in the first surface(11) of the board. A dam(17) is formed around the boundary of each unit. A groove(20) is formed outside of the both dams with predetermined depth. Input and output pads(19a,19b) are formed on the second surface(12), connected to the chip and bonding pads through conductive via holes(18a,18b). A semiconductor chip is attached on the each chip bonding pad. The chip and the wire bonding pads are connected to each other by conducting wires. Liquid molding material is spread on each unit. Sawing grooves with a blade(70), each unit is separated into an individual package. |
