| 摘要 |
Methods of bonding materials used in the manufacture of articles, including, but not limited to, absorbent articles such as sanitary napkins, pantiliners, tampons, absorbent interlabial devices, diapers, incontinence devices, wipes, and the like are disclosed. There are numerous aspects of the disclosed methods. In one aspect, the method involves bonding through incompatible materials during the process of making a composite structure comprising several materials. In another aspect, improvements are made that allow the method to be used to bond through relatively thick materials (e.g., materials having a thickness of greater than or equal to about 4 mm). In another aspect, the methods are provided with the ability to create a virtually unlimited number of bonding patterns in the materials to be bonded. In still another aspect, the methods of bonding utilize a compression step to improve bond formation. In still another aspect, methods of bonding that utilize a step of slitting a material through which the bonds are made are disclosed. |
