SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide a semiconductor device having such a structure that has a good heat radiation property and a high dielectric strength. CONSTITUTION: Each lead frame 2a for power chip has a power chip 41 mounted on one principal plane and has a suspension lead section 2e which is salient out of a mold resin formation area 55 as well as a lead terminal 2b which is also salient out of the mold resin formation area 55. This structure of each lead frame 2a for a power chip allows it to be supported by a plurality of suspension lead sections (2b and 2e) at the time of molding. On the other principal plane of the lead frame 2a, a metal block is so disposed as to oppose to the power chip 41.