发明名称 CONNECTION FOR CONDUCTING HIGH FREQUENCY SIGNAL BETWEEN A CIRCUIT AND A DISCRETE ELECTRICAL COMPONENT
摘要 An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.
申请公布号 KR20030033065(A) 申请公布日期 2003.04.26
申请号 KR20037003802 申请日期 2003.03.14
申请人 发明人
分类号 H01L21/60;H01L23/12;H01L23/66;H01L25/00;H05K1/02;H05K1/18;H05K3/32 主分类号 H01L21/60
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