| 摘要 |
PURPOSE: A printed circuit board(PCB) for packaging is provided to improve adhesion between a semiconductor chip and a PCB by forming a contact area extension part in a chip mounting part of the upper surface of the PCB so that a contact area with adhesive is increased. CONSTITUTION: Thermosetting resin forms a main body of the PCB. Circuit patterns are made of conductive thin films, formed on both confronting surfaces of the thermosetting resin, respectively. The chip mounting part(4) to which the semiconductor chip is to be attached is formed in the center of the upper surface of the thermosetting resin. The contact area extension part(3) is formed in the chip mounting part. A solder mask(5) as a solder resist is applied to the surface of the chip mounting part except the contact area extension part. |
