QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A quad flat no-lead(QFN) semiconductor package is provided to simplify a fabrication process by preventing resin from soaking into a wire bonding part so that a deflash process and a plating process are eliminated. CONSTITUTION: The first half etching part to which a semiconductor chip(110) is attached is formed on the edge of a leadframe(100) of a planar line type. A chip pad(102) includes the first through hole. A lead part(104) includes the second through hole and the second half etching part, position in the outside of the chip pad. The leadframe includes the first half etching part, the chip pad and the lead part. The semiconductor chip is attached to the chip pad of the leadframe by using epoxy(112). A wire(120) electrically connects a bond pad of the semiconductor chip with the lead part of the leadframe. The first etching part and the first through hole of the chip pad of the leadframe is filled with a molding well(130) of a quadrangular type. The second through hole and the second etching part of the lead part is filled with the molding well. A cover sealing part(132) is formed on the molding well formed on the lead part of the leadframe. A cover(140) is attached to the cover sealing part on the molding well by using adhesive(142), sealing the semiconductor chip, the wire and the leadframe.