| 摘要 |
<p>PURPOSE: A built-in module in element and its making process is provided to allow a component such as a semiconductor to be inspected as to the mounted state or their properties before embedding, lead to the improvement of the yields, enhance the strength and realize a high degree of productivity and high-density mounting. CONSTITUTION: A component built-in module comprises an insulating layer(101), wirings(102) integrated with both surfaces of the insulating layer, a via(103) connecting the wirings, and one or more components(104) selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. At least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding.</p> |
