| 摘要 |
PURPOSE: A method for fabricating a thin film through a spin-coating method is provided to improve step coverage by forming a blocking wall on the edge of a wafer in a spin-coating process after a coating material is sprayed so that the coating material is locked. CONSTITUTION: The blocking wall is formed in the periphery of the front surface of a substrate to prevent the coating material from being transferred from the center of the front surface of the substrate to the edge and the back surface of the substrate through the periphery of the front surface of the substrate. A thin film is formed on the front surface of the substrate including the blocking wall through a spin-coating method.
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