| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for making it possible to utilize the surface area of a chip effectively by improved ESD protection of an integrated circuit in which the function of the integrated circuit is not weakened when the mechanical stress of a bonding pad is applied. SOLUTION: In the device for improving ESD protection in an integrated circuit, passive elements are connected between a bonding pad and the integrated circuit in order to achieve the effective utilization of the chip area wherein the passive elements are placed above a nonconductive layer and below the bonding pad. If the bonding pad is damaged in bonding or testing, only a passive component is at most, short-circuited and functionalities of an output driver stage and the integrated circuit remain intact. |
