MULTI-CAVITY MOLDED WIRING BOARD, WIRING BOARD, PACKAGE FOR HOUSING MULTI-CAVITY MOLDED SEMICONDUCTOR DEVICE AND PACKAGE FOR HOUSING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable product improved in the transmission characteristics of high frequency signals by preventing a high frequency signal from being detoured to a conduction pattern by removing residue at the end of the conduction pattern on a signal line still as connected. SOLUTION: This package is provided with a plurality of wiring patterns 2 formed across a divided groove 6 between adjacent wiring board areas and a conduction pattern 5 formed over the divided groove 6 between the adjacent wiring patterns 2 and connected to only one wiring board area with respect to one wiring pattern 2, and the conduction pattern 5 is almost orthogonal to the divided groove 6 and curved between the wiring pattern 2 and the divided groove 6.