| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which is constituted by a package structure in which the number of using parts is small and an underfill with a resin is unnecessary after a user mounted. SOLUTION: In a method for manufacturing a semiconductor device, after a groove 3 is formed on a semiconductor wafer 1 having all electrodes 2 on the same plane by a chemical or mechanical polishing method, sealing is performed with a resin 4. Further, after the sealing with the resin, a flat part of the electrode 2 is exposed by a mechanical polishing method and a lower surface electrode 5 is newly formed on the exposed electrode. Finally, after separated into individual pieces by dicing-cutting, inspection and taping are performed to manufacture the semiconductor element.
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