ELECTRONIC PART MOUNTING DEVICE AND ELECTRONIC PART MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic part mounting device and an electronic part mounting method which can correspond to two embodiments of die bonding and flip chip bonding by the same device. SOLUTION: In an electronic part mounting device, electronic parts supplied to a part supply part 10 in a face-up state are taken out to be mounted on a board 3. A flip chip 13 supplied by a first holding table 11A is taken out by a take-up head 9 and is transferred to a mounting head 4 in an upside-down state to be mounted on the board 3. A die 14 supplied by a second holding table 11B is directly picked up by the mounting head 4 to be mounted on the board 3. Thus, it is possible to correspond to two embodiments of die bonding and flip chip bonding by the same device.