| 摘要 |
<p>PROBLEM TO BE SOLVED: To dispense with complex drawing-around work of vacuum piping by making the drawing-around work of the vacuum piping in a robot unnecessary, in the robot for semiconductor manufacturing equipment which vacuum- sucks wafers or the like. SOLUTION: In the robot 1 for industry, a first arm 4, a second arm 6 and a robot hand 8 are connected in order with a base part 2 by using joint parts 3, 5 and 7, respectively. A sucking part 9 for vacuum-sucking a semiconductor wafer 60 is arranged on the upper side of the robot hand 8, and a vacuum pump 10 which generates vacuum pressure by supplying electric power is arranged on the lower side of the robot hand 8. When the electric power is supplied to the vacuum pump 10 from a control circuit 20 in the base part 2 by using electric wires 21a, 21b, 21c and 21d, the vacuum pump 10 generates vacuum pressure, which is supplied to the sucking part 9 via a vent hole 9a which interconnects the sucking part 9 and the vacuum pump 10 arranged on the robot hand 8.</p> |
