THERMOCOMPRESSION BONDING DEVICE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a thermocompression bonding device for an electronic component which can efficiently heat the electronic component and shorten a tact time. SOLUTION: The thermocompression bonding device for the electronic component which bonds the electronic component to a substrate by thermocompression is provided with grid-shaped slits 14c around a component reverse reception range 14a corresponding to an electronic component mount position of the substrate on the reverse reception surface of a ceramic stage 14 which comes into contact with the reverse side of the substrate to receive the substrate from below. When the electronic component is pressed against the substrate received by the ceramic stage 14 from below while heated by a thermocompression head, heat conducted from the component reverse reception range 14a to outside is cut off by the slits 14c. Consequently, the value of heat diffused from inside to outside the ceramic stage 14 is reduced to shorten the time needed to raise the temperature of the electronic component up to a thermocompression bonding temperature.