发明名称 CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE AND SOCKET OR MOUNTED BOARD
摘要 PROBLEM TO BE SOLVED: To accurately align output terminals of a semiconductor device and contact terminals of a socket even if a small geometric distortion is caused in an outside dimension in the semiconductor device, and even if a narrower pitch of the output terminals is further realized. SOLUTION: This connecting structure for the semiconductor device and the socket or a mounted board is provided on both sides with paired positioning means capable of mutually maintaining the connecting relations for at least mutually positionally coincident two positions in both mutually overlapping space areas for connecting the semiconductor device and the socket or the mounted board in the correct positional relationship. Only by setting semiconductor device to the socket or the mounted board, even if there is a small geometric distortion in the outside dimension of the semiconductor device, the output terminals of the semiconductor device and the socket or the contact terminals or the connecting terminals of the mounted board can be accurately positioned, and can be surely connected to easily cope even with the narrower pitch of the output terminals.
申请公布号 JP2003123922(A) 申请公布日期 2003.04.25
申请号 JP20010313999 申请日期 2001.10.11
申请人 SONY CORP 发明人 YAMAUCHI TERUHITO
分类号 H01R33/76;H01L23/32;(IPC1-7):H01R33/76 主分类号 H01R33/76
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