| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency amplifier capable of miniaturizing a substrate area and dealing with a plurality of frequencies, a plurality of modulation systems and outputs. SOLUTION: In this high frequency amplifier, in order to configure a matching circuit for providing load impedance optimized to a plurality of frequency bands, outputs and signal modulation systems, the values of matching elements are changed within one matching circuit. When changing such a matching element value, a plurality of elements are connected through a micromechanical switch onto the matching circuit or two separated points on a transmission line are connected by using the micromechanical switch and ON/OFF of this micromechanical switch is controlled. Thus, the element value or transmission line length is changed. |
