| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosetting resin composition which can form a pattern excellent in dry etching resistance. SOLUTION: The photosetting resin composition is characterized in containing (A) an organosiloxane polymer compound having a repeating unit expressed by formula (1), wherein each of R<1> to R<4> represents a hydrocarbon group, n is 1 to 1,000 and X represents a group selected from among formulae (2), (3) and (4), (B) at least one compound selected from among amino condensed products modified with formalin or formalin-alcohol, phenyl compounds having two or more methylol groups or alkoxymethylol groups in average in one molecule and epoxy compounds having two or more epoxy groups in average in one molecule, (C) a photoacid generating agent and (D) (R<11> )m Si(OR<12> )4-m or its partially hydrolyzed condensed product, wherein R<11> represents a monovalent hydrocarbon group, R<12> represents an alkyl group and m is an integer from 0 to 2. |
