发明名称 METHOD AND DEVICE FOR FORMING BALL IN WIRE BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wire bonding device capable of activating a free electron on the surface of an electric torch, stabilizing an atmosphere around the electric torch, stabilizing electric discharge and further stabilizing the diameter of a ball. SOLUTION: The wire bonding device is provided with an insulating member 2 for covering the electric torch 1 by providing a space 3 near the electric torch 1 and a heater 5 attached to the insulating member 2 to heat the space 3.</p>
申请公布号 JP2003124247(A) 申请公布日期 2003.04.25
申请号 JP20010320577 申请日期 2001.10.18
申请人 SHINKAWA LTD 发明人 NISHIURA SHINICHI
分类号 H01L21/60;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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