| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having an air-bridge wiring structure which can prevent an external pressing force from intensively acting. SOLUTION: This semiconductor device 10 includes a first conductive part (14 and 16) formed on a semiconductor substrate 11, a second conductive part 20 formed crossing the first conductive parts, a bridge 23 formed on the crossing part of the second conductive part and the first conductive part in order to define a gap 22 between the crossing part and the first conductive part, a protrusion 24 which is formed on the non-crossing part of at least one of the first conductive part and the second conductive part and defines a gap 25 under it, and a protective film 26 which is formed on the semiconductor substrate in order to cover both the conductive parts and has a surface shape corresponding to the bridge and the protrusion. |
