| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board on which an electronic component of either an insertion type or surface mount type can be mounted without lowering the joining strength of the electronic component of the surface mount type. SOLUTION: Through holes 30 are formed nearby through holes 10 which are formed in the insulating substrate 1 for the printed wiring board and into which lead terminals of the electronic components can be inserted and through hole lands 31 of the through holes 30 are formed integrally with lands 11 of the through holes 10.
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