MANUFACTURING METHOD FOR PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board which makes easy an operation for manufacturing the wiring board and can prevent the trouble that a 2nd metal coating film is etched when an excessive 1st metal coating film is removed. SOLUTION: The method is characterized that a wiring pattern is formed by forming a resist coating film where a circuit is expected to be formed after a 1st thin metal coating film is formed on a surface of an insulating substrate, removing the resist coating film after etching, and then forming the 2nd metal coating film by carrying out electrolytic plating.