MULTI-CHIP PACKAGE HAVING SPACE INSERTED BETWEEN CHIPS AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip package and its manufacturing method that semiconductor chips having the same or a similar size are laminated and wire bonding between a lower chip and a substrate is practicable. SOLUTION: The multi-chip package is provided with a substrate having an upper surface and an under surface; a first chip mounted on the upper surface of the substrate and having an active surface; a spacer mounted on the active surface of the first chip; a second chip having an active surface and a back and the back mounted on the spacer; a first chip pad mounted on the active surface of the first chip; a second chip pad mounted on the active surface of the second chip; first and second bonding wires to electrically couple the first and second chips to the substrate; a package body to expose the terminal of the spacer as the first chip and the second chip and the first and second bonding wires are sealed; and an external connection terminal mounted on the under surface of the substrate. Further, a method for manufacturing the above-mentioned multi-chip package is provided.