| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a joint structure of a chip part to a bus bar where the bus bar of high production efficiency and low cost is used to improve the joining strength of a solder with high reliability. SOLUTION: At least one chip part 6 is mounted on bus bars 2 and 3, and a connection part 6t of the chip part 6 is jointed to the bus bars 2 and 3 with a solder. At that time, recesses 10 and 11 are formed at a solder land corresponding to the solder-wetted area of at least two bus bars 2 and 3 separated in advance. The connection part 6t of the chip part 6 is separated from the inner edge of the recess, and the chip part 6 is solder-jointed to the bus bars 2 and 3, so that a solder filet is formed between at least a part of the recesses 10 and 11 and the connection part 6t of the chip part 6.</p> |
