| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve an yield and productivity in a display device of a large screen and high precision, which requires an expensive bus flexible film for mounting COG, by lowering the resistance value of specific wiring so as to avoid requiring of the film and so as to dispense with increasing of the film thickness and pattern width of a wiring path. SOLUTION: A low resistance metal layer is selectively formed on a specific wiring path by plating. In addition, an organic insulation layer is formed on a low resistance metal layer by electrodeposition to improve the oxidation resistance and thermal resistance of the low resistance metal layer.</p> |
