发明名称 MOUNTING METHOD OF FLEXIBLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide the mounting method of a flexible substrate which is capable of efficiently mounting the flexible substrate on an objective work, on which electrodes having different mounting heights are formed. SOLUTION: In the mounting method of the flexible substrate, in which the flexible substrate 10 is welded by pressure on a work 2, having a step on the upper surface of the same and a plurality of electrodes 3, 4 having different mounting heights are formed thereon, the flexible substrate 10 is put on the mounting surface of the work 2, to which an ACF tape 5 is bonded, and the flexible substrate 10 is welded by pressure by a pressure welding tool 17. In this case, the flexible substrate 10 is pressed under a condition that a film member 18 of an elastic material having flexibility is interposed between the flexible substrate 10 and the pressure welding tool 17. According to the method, the quality of pressure welding is uniformised by absorbing the unevenness of the pressing condition due to the difference of the mounting heights and the pressure welding work can be effected by a single pressure welding process whereby the mounting work can be made efficient.
申请公布号 JP2003124256(A) 申请公布日期 2003.04.25
申请号 JP20010314891 申请日期 2001.10.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKANO YASUYUKI;ISHIKAWA TAKATOSHI;NAKAMURA TAKASHI
分类号 H05K3/32;H01L21/60;H05K1/14;H05K3/36;(IPC1-7):H01L21/60 主分类号 H05K3/32
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