发明名称 CONNECTING STRUCTURE OF MAIN AND SUB-CIRCUIT BOARDS FOR ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a connecting structure of a main and sub-circuit boards for an electronic device, capable of reducing the amplification of a noise by decreasing the linear part of a harness cable for connecting between the main and the sub-circuit boards. SOLUTION: The connecting structure of the main and sub-circuit boards for the electronic device comprises a structure in which the main circuit board M having a high-frequency clock signal generation source is connected to the sub-circuit board A in which a peripheral control circuit operating by receiving the high-frequency signal transmitted from the main circuit board M is mounted, via the harness cable, and this harness cable H is bent or curved and disposed.
申请公布号 JP2003124596(A) 申请公布日期 2003.04.25
申请号 JP20010313637 申请日期 2001.10.11
申请人 MURATA MACH LTD 发明人 FUKUMA TOSHIHARU;YAMASHITA ATSUSHI
分类号 H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K1/14
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