| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor chip and the mounting structure of the semiconductor chip, which are capable of surely conducting the bumps of respective semiconductor chips to connecting terminal units on a substrate, in the case that a plurality of semiconductor chips are mounted on the substrate through an anisotropic conductive film. SOLUTION: A plurality of semiconductor chips, on which a plurality of bumps are formed so as to be projected, are mounted on the substrate, on the surface of which a plurality of connecting terminal units are formed so as to be opposed to each bumps respectively so that the bumps are conducted to each connecting terminals through the anisotropic conductive film. The plurality of semiconductor chips are formed so that thicknesses are different from each other as a whole and when the semiconductor chips are mounted, the chips are welded by pressure onto the substrate sequentially from the chip having a thinner thickness to the same having a thicker thickness.
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