| 摘要 |
PROBLEM TO BE SOLVED: To prevent drop in purge pressure in exposure at a portion near the outer periphery of a wafer or a reticule, and increase in oxygen concentration due to generation of substitution fail. SOLUTION: The projection aligner has a movable stage 4, a chucking apparatus 14 that is arranged on the stage for retaining a substrate, a first gas-supply apparatus that supplies gas to a position to be exposed on the substrate, and a plane-like members 18a, 19a, 25a, and 25b that are arranged on a plane having the same or nearly the same height as the surface of the substrate while being adjacent to the outer-periphery section of the substrate and are divided into a plurality of portions.
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