| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor power module and a manufacturing method therefor in which heat radiation is improved, costs are reduced and electric insulation characteristics are satisfactory. SOLUTION: In the semiconductor power module, a lead frame 4 comprising a wiring pattern and an external terminal is fixed through an adhesive resin layer 3 onto an insulating resin layer 2. Besides, a metal insulating board, the adhesive resin layer 3 and the lead frame 4 previously packaging an element 6 are laminated and molded with resins while being pressurized and heated in such a state that the lead frame can be fixed through the adhesive resin layer 3 onto the insulating resin layer 2 in resin-molding. Further, the metal insulating board of a large area is manufactured by forming the adhesive resin layer 3 on the metal insulating board beforehand, and a punching process for an adhesive sheet in forming the adhesive resin layer 3 is not required. |
