| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a flash is generated or a lead is released from a resin at dicing in a process for fabricating a semiconductor device, to improve workability in dicing, productivity, and yield while each of semiconductor devices is allowed to be inspected even before dicing, related to a lead frame used for a leadless package, (semiconductor device) such as QFN. SOLUTION: A die pad 24 is specified to each of mounted semiconductor elements, with a plurality of leads 26 arrayed around each of die pads 24. Each die pad 24 and a corresponding plurality of leads 26 are supported by an adhesive tape 28. Each lead 26 is separated from the corresponding die pad 24 to extend outward in a comb, in the inside region of a region specified by a division line CL for final division into semiconductor devices. |
