METHOD FOR MANUFACTURING SILICON WAFER AND SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To obtain a method for manufacturing a silicon wafer and a silicon wafer in which the temperature of RTA treatment can be lowered or the treatment time thereof can be shortened by enhancing the hole injection efficiency. SOLUTION: The method for manufacturing a silicon wafer comprises a step S5 for heat-treating a silicon wafer in atmospheric gas to form new holes internally wherein the surface roughness Ra of the silicon wafer is set at 0.1μm or above prior to the heat treatment process.