| 摘要 |
PROBLEM TO BE SOLVED: To provide a bare chip mounting method and a mounting system capable of preventing faulty conduction between an IC chip and a circuit substrate due to chips produces upon dicing of a semiconductor wafer and reducing the loss of a time and a labor. SOLUTION: A previous process comprises a dicing process for dividing a conductor wafer 1 into each IC chip 7 under a condition that the wafer 1 is mounted on transfer equipment 2, a washing process for washing the semiconductor wafer 1 after the dicing, a bump bonding process for transferring the semiconductor wafer 1, whose washing is finished, to an assembling process under a condition that the wafer 1 is mounted on the transfer equipment 2 to form a bump on the electrode pad of the semiconductor wafer 1 and a mounting process for mounting the respective IC chips 7, on which the bump is formed, onto a circuit forming body. |
