| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor suitable for bulk mounting. SOLUTION: A pair of upper electrodes 2 is formed on the top of an insulating substrate 1, and a resistor layer 3 is formed in such a manner that it is superposed on it. On the surface of the resistor layer, the first protective layer 4 and the second protective layer 5 are formed. A peripheral electrode layer 6 is formed astride the surfaces 5 of a part of the top electrode 2, the end face of the insulating substrate 1, the underside of the insulating substrate 1 and both sides of the insulating substrate 1 at both end parts, and electrically conductive adhesive is used for the materials. It is formed by dipping and coating. On the peripheral electrode layer, a nickel plate 7 and a solder plate 8 are applied in this order. Since the peripheral electrode layer is a conductive adhesive, both ends are raised, so as to permit the surface of the solder plate to be higher than the surface of the second protective layer.</p> |
