CHIP ANTENNA PACKAGED SUBSTRATE AND COMMUNICATION DEVICE FOR MOVING OBJECT

摘要

PROBLEM TO BE SOLVED: To provide a chip antenna packaged substrate and a mobile communication device in which antenna characteristics are improved by optimizing an antenna installing position and the productivity of equipment to be packaged can be improved. SOLUTION: In the chip antenna packaged substrate provided with a packaging substrate 2, a ground electrode 7 provided on the packaged substrate 2, an antenna packaged area 4 in which the ground electrode 7 is not located, provided on the packaged substrate 2 and a chip antenna 1 packaged in the antenna packaging area 4, while electrically bonding a terminal part provided on the chip antenna 1 to the packaged substrate 2 directly or through a bonding member, the chip antenna 1 is attached onto the packaged substrate 2 while being tilted.