| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which has the superior transmission efficiency of high-frequency signal and high airtight reliability. SOLUTION: A circuit board 6 placed on the upper principal plane of a basic substance 1 is such that a line conductor 6a with its one end part electrically connected to a central conductor 3b and the other end part electrically connected to a semiconductor element 5 is formed on the top face of an insulation board, and common-plane grounded conductors 6c are formed on both sides of the line conductor 6a nearly at the same distance from the line conductor 6a. The end face of the insulation substrate on one end part side is in contact with the inner surface of a frame body 2, and the common-plane grounded conductors 6c are electrically connected to the inner surface of the frame body 2 via an L-shaped conductive member 12 which is 2 to 15 mm apart from the central conductor 3b. |
