| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which the heat of a chip which accumulates heat much is evenly dispersed across it. SOLUTION: A semiconductor package 200 is provided which prevents degradation in performance of a chip 120, such as a CPU chip, which is caused by a hot spot generated during operation, and an interface between the chip 120, a TIM156, and a lid 140 absorbs a thermo-mechanical stress. The chip 120 is electrically connected, for example, flip-chip bonded to a package board 110. The lid 140 is disposed on the rear surface of the chip 120 by the TIM156 inserted between the lid 140 and the chip 120, for thermal coupling.
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