| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a both-sided wiring board which has specially high- precision circuit pattern formed on at least one surface through the small number of manufacturing processes as to a flexible film which is apt to vary in size under the influence of heat, humidity, and an external force. SOLUTION: A manufacturing method for the circuit board comprises a process of sticking a reinforcing plate on one metal layer formation surface through a peelable organic body layer after forming the metal layer of <5μm in thickness on at least one surface of the flexible film, and a process of peeling the flexible film off the reinforcing plate after forming a circuit pattern on the surface where the reinforcing plate is not stuck.
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