| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the conventional semiconductor device for an optical system such as a CCD and a CMOS sensor of the inter-line system that has had to be contained in a package of a hollow structure when no transparent resin layer can be formed on the surface of the semiconductor device. SOLUTION: In the semiconductor device of this invention, a semiconductor device 24 is fixed onto a conductive pattern 22 comprising an island 221 and an external electrode 222, and the semiconductor device 24 and the conductive pattern 22 are electrically connected by a metallic thin wire 25. Then the semiconductor device 24 is located in a recessed part 28 comprising a frame 26 and a glass plate 29 or the like to realize a hollow structure. Moreover, a transparent resin to obtain a spectral characteristic of a desired light is coated to the entire surface of the glass plate 29. As a result, an air layer is interposed between the glass plate 29 and the semiconductor device 24 to enhance also a lens effect of an imaging lens. |
