发明名称 LEAD FRAME AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a lead frame which is manufactured by press working with a precision press die and is used for a leadless package. SOLUTION: A lead frame 50 comprises a lead part 50a which, extending as a comb inwardly from the frame part 50b, comprises a tip part 30a, a central part 30, and a base part 30b connected to the frame part 50b. The tip part 30a connects to the central part 30 through a first constricted part while the central part 30a connects to the base part 30b through a second constricted part. The tip part 30a and both side parts 30c at the central part 30 of the lead part 50a are thinner than other part of the lead part 50a.
申请公布号 JP2003124423(A) 申请公布日期 2003.04.25
申请号 JP20010312199 申请日期 2001.10.10
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MATSUZAWA HIDEKI;SOTODANI HIDEKI;KOMATSU HIROYUKI;INATSUGI TATSUYA;ABE AKINOBU
分类号 H01L23/50;H01L21/44;H01L21/48;H01L23/48;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址