| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board of high reliability having an insulating layer which is superior in insulation reliability, has high thermal resistance and toughness, is superior in copper wire adhesion, and can form a fine roughened surface suitable for forming a fine pattern, and to provide a method for manufacturing a multilayer printed board which can manufacture the printed board easily at a low cost. SOLUTION: The multilayer printed wiring board is manufactured by a process (a) wherein an insulating resin layer formed by thermally hardening resin mixture containing at least thermosetting resin and thermoplastic resin is disposed on a core base substance in which a conductor circuit is formed, a process (b) wherein a surface of the insulating resin layer is treated by using treating liquid containing at least one or more kinds of organic solvent, and a process (c) wherein a conductor circuit of the next layer is formed by plating and etching on a surface of the insulating resin layer. It is preferable that the organic solvent is insoluble to single hardened material of the thermosetting resin and soluble to a thermoplastic resin single body. |
