| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device whereby a resin layer can be repeatedly formed into the same shape with a small thickness and accurate dimensions, the method is applicable even when components susceptible to heat are mounted on a substrate, and only selected components can be coated with the resin layer on the same substrate. SOLUTION: The method comprises the step of placing semiconductor chips 12a and 12c on a substrate 11a, the step of dipping the substrate 11a having the semiconductor chips 12a and 12c placed thereon into uncured liquid photo- curing resin 16, and the step of curing the photo-curing resin 16 by emitting light thereon and coating the semiconductor chips 12a and 12c on the substrate 11a with cured photo-curing resin 16b.
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