| 摘要 |
PROBLEM TO BE SOLVED: To provide a plastic film on which a metal film used for forming an electrode included in an electronic part by transfer is formed or especially, an electronic part metal film transfer film equipped with a metal film which is superior in adhesion to a transfer target surface. SOLUTION: This electronic part metal film transfer film has a structure composed of a plastic film, a release layer, and a metal film, where the release layer and the metal film are formed on the plastic film in this sequence. Furthermore, an adhesive resin layer is laminated on the metal film.
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