发明名称 Chemical mechanical polishing slurry
摘要 A liquid suspension for planarizing an outer surface of a material comprises a liquid suspension medium of a specific liquid density; and a plurality of solid, contact-sensitive abrasive particles of a constant solid density and suspended in the liquid suspension medium. The liquid and solid densities are approximately the same so that the abrasive particles freely and stably suspend in the liquid suspension medium, without gravitational separation by settling down or floating up. In this way, damaging contacts of the solid abrasive particles with one another are minimized.
申请公布号 US2003077995(A1) 申请公布日期 2003.04.24
申请号 US20020262086 申请日期 2002.09.30
申请人 LI CHOU H.;LI SUZANNE C. 发明人 LI CHOU H.;LI SUZANNE C.
分类号 B24B37/04;C09G1/02;(IPC1-7):B24D11/00 主分类号 B24B37/04
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