| 摘要 |
<p>The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield (20) with a venturi-shaped partition (25) and an aligned partition (24) below the printed circuit boards, and operating a plurality of eductors (22) below the floating shield. The means to alternately generate a laminar flow of electrolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors. The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.</p> |
