发明名称 MODULE COMPONENT
摘要 <p>A module component has a connection conductor for electrically connecting a wiring circuit pattern provided outside an insulation resin layer and a wiring circuit pattern provided inside the insulation resin layer, active components and passive components electrically connected on the wiring circuit patterns, and a coil formed on a laminate. The coil is formed of a coil pattern made of a conductor on the insulation layer. A magnetic material provided on the upper and lower insulation resin layers sandwiches the coil pattern.</p>
申请公布号 WO2003034494(P1) 申请公布日期 2003.04.24
申请号 JP2002010591 申请日期 2002.10.11
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